Notable Technical Inquiry

Can the high-strain recovery and temperature memory aspects of shape memory alloys make them useful for developing a coupling between the dissimilar materials of high-temperature materials?

DSIAC received a technical inquiry on using shape memory alloys (SMAs) as a joining or coupling intermediate for materials with dissimilar thermal expansion coefficients (CTEs) in extreme thermal gradients.  Historically, the integration of high-temperature materials used for leading edges, control surfaces, heat shields, etc., with metallic structural components has been challenging due to the brittle nature of the high-temperature materials and their differences in CTE from the more structural components.  The inquirer seeks information about using the features of high-strain…

Voice From The Community

Brenda VanMil

Physicist, Quantum Technology Branch, CCDC Army Research Laboratory

I am currently involved in developing silicon carbide for quantum technologies. I have over 20 years of experience in semiconductor growth by molecular beam epitaxy, chemical vapor deposition (CVD), and atomic layer deposition, along with many of the characterization techniques required to understand the properties of grown material. ARL has invested in a silicon carbide CVD growth capability to allow us to perform rapid feedback from characterization back into the growth effort. Our team is currently working to understand, optimize, and engineer quantum properties in the solid state for quantum-enhanced sensing and communications.

In This Issue

Defense Department Awards $4 million to Eight Universities for Hypersonics Research

The Department of Defense (DoD) has awarded $4 million in grants to eight distinguished universities to support work on uniquely-complex hypersonics challenges. The […]

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