Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes image
July 10, 2015 | Source: Electronics Cooling

In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies (CCA). OHP-embedded heat sinks efficiently transport heat generated by CCA centrally located components to the assembly’s edges. Attention is paid to minimize the size, weight, cost and potential operability penalties associated with the incorporation of the OHP-embedded heat sink, to improve upon existing high performance heat sinks (e.g., Al-Be composites, encapsulated annealed pyrolitic graphite, or outfitted with Copper-Water heat pipes). This article provides a brief update on current OHP technology and summarizes initial findings from prototype OHP-embedded heat sinks.