bondline thickness

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Noncontacting Methods for Adhesive Bond Primer Thickness Measurements

  The Defense Systems Information Analysis Center (DSIAC) received a technical inquiry requesting information on available options for noncontact thickness measurements of a mostly transparent adhesive primer.  The inquirer specified that it would be preferable…

Microscopes for Measuring Bondline Thicknesses

DSIAC was asked to research what types of microscopes were best for measuring bondline thicknesses caused by the adhesive bonding of metal and composite samples. The microscope would need to be able to make measurements in the range…